Laser Direct Structuring

Laser direct structuring (LDS) is an innovative, environmentally friendly and precise technology for the manufacture of three-dimensional molded interconnect devices (MIDs).


Cover; Producer: Company Bourns, Ireland

In the LDS process a laser first "burns" a high-resolution conductive pattern directly onto the injection molded part. This activates a special additive already incorporated into the thermoplastic. The conductive tracks are then built up in an electroless copper bath.
In this way very complex three-dimensional conductive tracks can be produced.

The LDS grades developed by LANXESS can be used for:

- injection molding / extrusion
- lead-free soldering processes

Additional grades (e.g. with improved impact strength) are available on request.

The polyester-based LDS grades can be metallized very successfully, as has been shown in numerous applications.

Published information regarding the LDS process
pdfPocan DPT7140LDS for RFID transponderCase Study
download pdfLaser direct structuring of three-dimensional Pocan interconnect devicesFlyer
search LDS gradesLDS gradesProduct search
search LDSall LDS topicsFull-text search

More information
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