Laser direct structuring (LDS) is an innovative, environmentally friendly and precise technology for the manufacture of three-dimensional molded interconnect devices (MIDs).
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In the LDS process a laser first "burns" a high-resolution conductive pattern directly onto the injection molded part. This activates a special additive already incorporated into the thermoplastic. The conductive tracks are then built up in an electroless copper bath. In this way very complex three-dimensional conductive tracks can be produced.
The LDS grades developed by LANXESS can be used for: